TCP200 silicone thermal pad has a 2.0 W/mK thermal conductivity for exceptionally low thermal resistance. For greater ease of application and use, the pad's natural inherent tack eliminates the need for an additional adhesive coating that may inhibit thermal performance by increasing interfacial resistance. TCP200 cutting-edge supplier of silicone-based materials for aerospace, aircraft, electronics and photonics industries.
Products Features:
◇2.00 W/mk thermal conductivity
◇Low Thermal Resistance at Low Pressure
◇Naturally tacky for easy application
◇Electrically insulating
Typical Applications Include:
Network Equipement, Mass Storage devices
Highly Stable at extreme Temperature
Required for outstanding heating Transfer
Cooling Module, Thermal module for Special application
Highly Stable at extreme Temperature
Required for outstanding heating Transfer
Cooling Module, Thermal module for Special application
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