Improves heat transfer between a CPU/chipset and heatsink with easy-to-use SinoGuide brand thermal pads.
Products Features:
◇1.00 W/mk thermal conductivity
◇ Low Hardness
◇Cost-effective which is made through advanced manufacturing process
◇ Electrically insulating
Typical Applications Include:
Bonding bus bars in a variety of electronic modules and sub-assemblies
Attaching a metal-based component to a heat sink
Bonding a heat sink to a variety of ASIC, graphic chip and CPU packages
Bonding flexible circuits to a rigid heat spreader or thermal plane
Assembly tapes for BGA heat spreader
Attaching PCB assemblies to housings
Attaching a metal-based component to a heat sink
Bonding a heat sink to a variety of ASIC, graphic chip and CPU packages
Bonding flexible circuits to a rigid heat spreader or thermal plane
Assembly tapes for BGA heat spreader
Attaching PCB assemblies to housings
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