Thermal Conductive Gap Filler Pad TCP110U

TCP110U has a 1.1 W/mK thermal conductivity for exceptionally low thermal resistance. Naturally tacky on one side for easy assembly,  A special resin material that is easy to pull from the liner and place in the application enhances handling. Endowed with stress absorbing flexibility, the gap filler pad TCP110U is reinforced with a fiberglass carrier on one side for easy handling and enhanced puncture, shear, and tear resistance. 

Products Features:

 ◇Thermal conductivity: 1.10 W/mk;
◇Fiberglass Reinforcement;
◇Naturally tacky on one side for easy assembly;
◇Electrically insulating;
◇Resist to puncture,shear and tear;

Typical Applications Include:

---Network Equipement, Mass Storage devices
---Highly Stable at extreme Temperature
---Required for outstanding heating Transfer 
---Cooling Module, Thermal module for Special application 

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