Showing posts with label Thermal Management. Show all posts
Showing posts with label Thermal Management. Show all posts

Tuesday, August 30, 2016

Thermal Management for The Needs of Evolving Electronics Applications





Challenging Application Requirements


To simplify operations, manufacturers are seeking TIM platforms that offer greater versatility and options across application categories. Could, for example, a material be formulated to deliver both high thermal performance and long-term reliability, or even compressibility combined with high thermal performance and long-term reliability?  The answer rests in the design flexibility – or form and function – of their molecular structures, which are explored below.
Key TIM Solutions:  Form and Function

Most PCMs contain wax-based polymers, transforming from a solid state to a softened or gel state as the temperature reaches its phase change or melt temperature. The melting process, which is reversible, occurs when temperatures exceed the melt temperature – typically in the 45°C to 70°C range.
Figure 1 shows the transition from a solid to liquid state and the impact of temperature on viscosity.  Increasing temperatures result in low viscosity, which enables high wetting properties, thin bond lines and low contact resistance for improved TI.

In addition, as the temperature decreases, the PCM solidifies, maintaining the polymer matrix integrity and thus long-term reliability. As with most TIMs, PCMs include a filler material, usually a metal or ceramic powder, responsible for conducting heat. Filler loading also affects viscosity and flowability, and fillers are chosen to provide the best balance. Available in film form factor and in a paste format, PCMs are easy to apply.   Recent technology advances will likely make them available in a gap pad format too, to meet specific needs for compression.

Tuesday, August 2, 2016

Thermal Pad for LED Thermal Management

2W/m.K Cooling thermal conductive heatsink silicone soft 
gap pad TCP200


Features
Very good thermal conductivity
Compliancy, high compressibility
Natural tack
Low oil bleed- long term stability
Electrical insulation
REACH Compliant
RoHS Compliant

Applications
Electronic components: IC, CPU, MOS, LED, M/B, P/S, Heat Sink,
LCD-TV, Notebook PC, PC, Telecom Device, Wireless Hub…..etc
DDR ll Module, DVD Applications, Hand-set applications…..etc

Properties
PropertiesTCP200UnitToleranceTest Method
ColorWhite--Visual
Thickness0.5~5.0mm-ASTM D374
0.0197~0.1969inch-ASTM D374
Thermal Conductivity2W/m.k±0.2ASTM D5470
Flame RatingV-0--UL 94
Dielectric Breakdown Voltage16KV/mm±1.6ASTM D149
Weight Loss<1%-ASTM E595
Specific Gravity2.4g/cm3±0.2ASTM D792
Working Temperature-45~+200°C--
Volume Resistance>1012Ohm-cm-ASTM D257
Elongation300%-ASTM D412
Tensile Strength1Kgf/cm2-ASTM D412
Standard ShapeSheet ones---
Hardness30Shore 00±10ASTM D2240
Configurations available: 300mm*300mm, specific size could be provided according to your requirements.
Packaging & Shipping
   -Packaging: Export standard packing
   -Shipping: FOB Taiwan, EMS / DHL / FedEx / according to your request
Our Services
  We provide free samples for testing. Please feel free to contact our sales.
  We can offer competitive prices and after sales services.