Thermal Silicon Gap tcp200

 TCP200 silicone thermal pad has a 2.0 W/mK thermal conductivity for exceptionally low thermal resistance. For greater ease of application and use, the pad's natural inherent tack eliminates the need for an additional adhesive coating that may inhibit thermal performance by increasing interfacial resistance.  TCP200 cutting-edge supplier of silicone-based materials for aerospace, aircraft, electronics and photonics industries.

Products Features:

◇2.00 W/mk thermal conductivity 
◇Low Thermal Resistance at Low Pressure
◇Naturally tacky for easy application
◇Electrically insulating
 

Typical Applications Include:

Network Equipement, Mass Storage devices
Highly Stable at extreme Temperature
Required for outstanding heating Transfer 
Cooling Module, Thermal module for Special application 

Thermal Conductive Pads TCP150

Products Features:

◇1.5 W/mk High Thermal Conductivity
◇Low Hardness and Cost effective
◇Natural tacky
◇Electrically insulating
◇Easy assembly and application

 

Typical Applications Include:

--Set-Top Box,Power Modules/Supply
--Led Lighting, LCD TV, Telecom device
--Network Router/Adapter 
--Cooling Module, Thermal module
--Vehicle-intelligence Terminal

Thermal Conductive Gap Filler Pad TCP110U

TCP110U has a 1.1 W/mK thermal conductivity for exceptionally low thermal resistance. Naturally tacky on one side for easy assembly,  A special resin material that is easy to pull from the liner and place in the application enhances handling. Endowed with stress absorbing flexibility, the gap filler pad TCP110U is reinforced with a fiberglass carrier on one side for easy handling and enhanced puncture, shear, and tear resistance. 

Products Features:

 ◇Thermal conductivity: 1.10 W/mk;
◇Fiberglass Reinforcement;
◇Naturally tacky on one side for easy assembly;
◇Electrically insulating;
◇Resist to puncture,shear and tear;

Typical Applications Include:

---Network Equipement, Mass Storage devices
---Highly Stable at extreme Temperature
---Required for outstanding heating Transfer 
---Cooling Module, Thermal module for Special application 

http://www.sg-thermal.com/Thermal-Pad/TCP110U_Thermal_Conductive_Gap_Filler_Pad_Materials_153.html

Thermal Conductive Pad TCP100

Improves heat transfer between a CPU/chipset and heatsink with easy-to-use SinoGuide brand thermal pads.

Products Features:

◇1.00 W/mk thermal conductivity
◇ Low Hardness
◇Cost-effective which is made through advanced manufacturing process
◇ Electrically insulating

Typical Applications Include:

Bonding bus bars in a variety of electronic modules and sub-assemblies
Attaching a metal-based component to a heat sink
Bonding a heat sink to a variety of ASIC, graphic chip and CPU packages
Bonding flexible circuits to a rigid heat spreader or thermal plane 
Assembly tapes for BGA heat spreader 
Attaching PCB assemblies to housings

Thermal Insulating Materials TCP20

Products Features:

◇Thermal Conductivity: 0.20W/m.k
◇High compressible closed-cell silicone foam
◇ Thermal insulating and low compressure Set 
 

Typical Applications Include:

Ultra Soft and Highly compressible for low compression force application
High Performance of sealing and gasket, super insulator, vibration damping 

http://www.sg-thermal.com/Thermal-Pad/TCP20_Series_Super_Insulating_Materials.html