Friday, June 9, 2017

Thermal Silicon Gap tcp200


 TCP200 silicone thermal pad has a 2.0 W/mK thermal conductivity for exceptionally low thermal resistance. For greater ease of application and use, the pad's natural inherent tack eliminates the need for an additional adhesive coating that may inhibit thermal performance by increasing interfacial resistance.  TCP200 cutting-edge supplier of silicone-based materials for aerospace, aircraft, electronics and photonics industries.



Products Features:


2.00 W/mk thermal conductivity 
Low Thermal Resistance at Low Pressure
Naturally tacky for easy application
Electrically insulating
 

Typical Applications Include:


Network Equipement, Mass Storage devices
Highly Stable at extreme Temperature
Required for outstanding heating Transfer 
Cooling Module, Thermal module for Special application 

Thermal Conductive Pads TCP150

Products Features:


◇1.5 W/mk High Thermal Conductivity
Low Hardness and Cost effective
Natural tacky
Electrically insulating
Easy assembly and application

 

Typical Applications Include:


--Set-Top Box,Power Modules/Supply
--Led Lighting, LCD TV, Telecom device
--Network Router/Adapter 
--Cooling Module, Thermal module
--Vehicle-intelligence Terminal

Thermal Conductive Gap Filler Pad TCP110U

TCP110U has a 1.1 W/mK thermal conductivity for exceptionally low thermal resistance. Naturally tacky on one side for easy assembly,  A special resin material that is easy to pull from the liner and place in the application enhances handling. Endowed with stress absorbing flexibility, the gap filler pad TCP110U is reinforced with a fiberglass carrier on one side for easy handling and enhanced puncture, shear, and tear resistance. 

Products Features:


 Thermal conductivity: 1.10 W/mk;
Fiberglass Reinforcement;
Naturally tacky on one side for easy assembly;
Electrically insulating;
Resist to puncture,shear and tear;

Typical Applications Include:


---Network Equipement, Mass Storage devices
---Highly Stable at extreme Temperature
---Required for outstanding heating Transfer 
---Cooling Module, Thermal module for Special application 

Thermal Conductive Pad TCP100

Improves heat transfer between a CPU/chipset and heatsink with easy-to-use SinoGuide brand thermal pads.

Products Features:


1.00 W/mk thermal conductivity
 Low Hardness
Cost-effective which is made through advanced manufacturing process
 Electrically insulating

Typical Applications Include:


Bonding bus bars in a variety of electronic modules and sub-assemblies
Attaching a metal-based component to a heat sink
Bonding a heat sink to a variety of ASIC, graphic chip and CPU packages
Bonding flexible circuits to a rigid heat spreader or thermal plane 
Assembly tapes for BGA heat spreader 
Attaching PCB assemblies to housings

Thermal Insulating Materials TCP20

Products Features:


Thermal Conductivity: 0.20W/m.k
High compressible closed-cell silicone foam
 Thermal insulating and low compressure Set 
 

Typical Applications Include:


Ultra Soft and Highly compressible for low compression force application
High Performance of sealing and gasket, super insulator, vibration damping 

Friday, January 13, 2017

Ultra-soft Thermal Interface Material with Good EMI Absorption from Sinoguide Technology

Sinoguide Technology R&D technical manager Mr.William is developing high performance thermal interface materials (TIMs) that have a superior ability to transfer heat and a strong capacity to keep cool.
SHENZHEN, China - Dec. 22, 2016 -- For the microelectronics field, the military and private sectors alike need solutions to technologic challenges. Sinoguide Technology R&D technical manager Mr.William is developing high performance thermal interface materials (TIMs) that have a superior ability to transfer heat and a strong capacity to keep cool.
Thermal interface materials have long been recognized as the market's most effective thermal management products to fill unique and intricate air voids and gaps. Now, these trusted materials take device protection one step further by integrating electromagnetic energy absorption functionality.  With thermal conductivity of 1.1 W/m-K and satisfied EMI absorption, TCP110U provides robust thermal management control and an added level of EMI protection. 
TCP110U improved wet-out at the interface results in thermal performance that is superior to other competitive materials with a similar grade.  Thermal conductivity is also enhanced by the material's natural tack on one side, which eliminates the requirement for any thermally-impeding adhesive layers and also makes component rework simple. With another side fiberglass reinforced, it is highly improved on puncture, shear and tear resistance.
Our global team of Applications Engineers are knowledgeable about silicone and applications spanning multiple industries. These include metallurgical casting, electronics, chemical, nuclear, defense/aerospace, solar, LED, semiconductor, and other high temperature processes.

Regardless of your product design phase (concept, prototyping, or mass production), we offer technical answers to some of your most challenging problems with a fast response time.

Thermal Interface Materials Advanced Thermal Management Solutions

SinoGuide™ high performance thermal interface materials (TIMs) are designed for long life, mission critical applications with extreme heat cycles. HITHERM™ TIMs are made of flexible graphite specifically engineered for demanding lighting, computing and power electronics applications.

SinoGuide™ Thermal Interface Materials


Advanced Thermal Management Solutions Consistent, reliable thermal performance enabling zero maintenance applications

Will not flow or pump out under any thermal extremes, thermal cycles, or part orientation

Assembly-ready foil form factor eliminates dispensing and cleaning processes

“NASA certified” minimal outgassing prevents fouling of optics in lighting applications

Material Performance

When determining which grade and thickness of SinoGuide™ TIMs will work for your application, the effective thermal impedance is the critical factor. The thermal impedance is the combination of the thermal resistance at the contact surfaces and the bulk resistance of the TIM.