Wednesday, August 3, 2016

Computer Cooling Specialist Three New SinoGuide-PAD

Thermal pad is aid the conduction of heat away from the component being cooled (such as CPU or chip) and into the heat sink.

Computer cooling specialist SinoGuide has announced a series of three new SinoGuide-PAD thermal pads. Meanwhile the cooling specialists at Sinoguide have started to make available thermal pad material that you simply cut to shape before application. This launched Thermal Pad product described as a "new silicone based thermal compound for all coolers". The Thermal Pad material can easily be cut to shape to fit the surface area of any component.


Three new Sinoguide-PAD thermal interface products, TCP300, TCP500, and TCP700, will be made available this summer. These pads differ in their Thermal Performance, Spread Ease and Particle Density and are suited to varying applications/users. According to SinoGuide's own descriptions the pads vary as follows:


TCP300 will offer the absolute best in performance and particle density

TCP500 will offer a good combination of performance and easy application

TCP700 is extremely easy to apply and is perfect for entry level users

With its low hardness the Thermal Pad is said to easily fill gaps and cool uneven surfaces. The material offers high thermal conductivity and works at low pressure to maximise heat transfer. Arctic says it can be great for use with memory chips, CPUs, MCUs, DSPs and other densely packed ICs.Handling the electrically non-conductive thermal pads is said to be safe and it will minimise the chance of damage to your system during installation.A key performance spec of the SinoGuide Thermal Pad is the thermal conductivity of 6.0W/mK.

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