SinoGuide Form In Place Gap Fillers
Fully Cured Thermally Conductive Form-in-Place Gap Fillers are SinoGuide’ latest development in thermally conductive gap fillers. These unique thermal interface materials are ideal for applications where typical gap filling pads cause too much stress on component solder joints and leads, resulting in damage to the printed circuit board. These pads are highly conformable, one component pre-cured silicone that can be dispensed to fill large and uneven gaps in electronics assemblies. The visco-elastic paste is a form stable, fully cured silicone material that takes little to no compressive force to deform during assembly. The “G” versions contain 0.010” glass beads, used for a compression stop for.
Thermal Interface Material (TIM) provides efficient thermal exchange between the processor Integrated Heat Spreader (IHS) and the fan-heatsink.
Clean, production friendly and efficient. Alternative to mica, ceramics or grease. Thermal conductivity range from 1.0 to 7.5W/mºk
No comments:
Post a Comment