Thursday, July 28, 2016

SinoGuide Technology Management Solutions

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes.

SinoGuide Technology offers a variety of thermally conductive gap filler materials in many formats including silicone, non-silicone, pads, putty and dispensable.  SinoGuide® Gap Filler materials offer a range of thermal conductivities, hardnesses and thicknesses.  Our line of SinoGuide® Gap Filler materials have been designed to achieve desired thermal resistance between electrical components in today’s advanced electronics designs.
VIEW PRODUCT LIST / DOWNLOAD DATA SHEETS

SinoGuide® Gap Filler PAD PRODUCTS

    • We are able to supply SinoGuide® Gap Filler Pad materials on rolls, providing maximum material yield and cost savings.
    • Silicone & Non-Silicone materials
    • Thermal Conductivities:  1-7 W/mK
    • Thickness Range:  0.10 – 5mm*
    • Durometer Range(Shore 00):  5 – 80*
    • Various colors available, including Black
    • All Gap Filler Pad Products are rated UL V-0
    • RoHS and HF Compliant
    • Good surface wetting
    • Conformable
*ranges vary based on product type

SinoGuide® Gap Filler DISPENSABLE PRODUCTS

    • Silicone, Non-silicone and thermal grease products
    • Two-part dispensable products available
    • Thermal conductivity up to 7 W/mK
    • Ideal for applications where thin bond lines and conformability are desired
    • Low compression force required
    • Low stress on components during assembly
    • RoHS and HF Compliant
    • Good surface wetting
    • Conformable

Other SinoGuide® Thermal Interface Materials

  • Phase Change
  • Heat Spreaders
  • Tapes and Transfer Adhesives
  • Dielectric Pads

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