Tuesday, July 26, 2016

Why Use Thermal Interface Materials for Your Thermal Projects

With the high packing density of power semiconductors, transistor chips and discrete components, etc., the generated heat has to be conducted away as efficiently as possible. Our Company has solutions for almost every type of heat problem and application by offering films, adhesive tapes, thermal grease, gap fillers and other materials.
Thermal interfacial materials (TIMs) are thermally conductive materials, which are applied to increase thermal contact conductance across jointed solid surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor.
Without thermal interface material, the heat flow go through joint face slowly, and the thermal conductive performance is bad.
Using thermal interface material to link two joint faces, the heat flow go through equally, and the thermal conductive performance is good.

Product Description : SinoGuide-PAD is a family of thermally conductive and electrically insulating silicone pads. They are clean, production friendly and efficient alternative to mica, ceramics or grease and will provide superb protection against damage due to deformation, shock or vibration. Available with or without adhesive for easy handling and installation. 

SinoGuide Core Value
Customer Orientation – We both help and learn from our customers daily.
Quality – We utilize quality-oriented processes and believe in full transparency in providing reliable, consistent products and services.
Communication – We communicate openly, pro-actively, candidly, and responsibly with our customers.

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